Description

Job Description Overview:

The Thermal / Mechanical System Architect is responsible for architecting the system level thermal and mechanical design for our NUC products, which includes the system enclosure, thermal module, and physical interfacing. This is a key leadership role in defining and resolving system level challenges from early concepts and mock-ups through to final production. The ideal candidate will have experience in PC chassis and/or thermal module architecture and design and have a passion for inventing and working on new product innovations and rapid prototyping.

Essential Duties and Responsibilities:

Leading the system-level and component-level thermal and mechanical conceptual design across various small form factor systems and throughout the product life cycle.
Defining system architecture for new products, while balancing performance, system-level acoustics, cost, and schedule requirements.
Creating ground-up 3D models and renderings based on the team's vision for the product, clearly supporting the expected system performance and aesthetics.
Creatively solving challenging thermal scenarios in high-density (high wattage per unit volume) systems to drive new system-level innovations
Designing and running thermal and heat-flow simulations, using standard industry-leading tools, to better inform early design ideas and partner feedback
Creating, fabricating, and validating ground-up system mock-ups and prototypes as part of advanced system planning
Reviewing and refining ODM/supplier thermomechanical design proposals to ensure that they deliver the best performing solutions to meet the project needs
Validating physical designs and components, including hands-on testing of samples
Implementing and validating platform thermal management systems
Tuning the final thermal and power management subsystem for optimal system performance and acoustics, which may include fan table configuration, dynamic system sensing and response, etc.
Drive the resolution of various thermomechanical-related issues throughout the product life cycle
Working on-site in a lab environment and meeting regularly with partners in Asia time zones

Knowledge and Skills:

Advanced proficiency in MCAD design tools (e.g., Creo, Solidworks).
Knowledge of materials, structural, stress, acoustic, EMI/RFI, vibration, and industry standards is a plus.
Working experience and proficiency in injection molding, CNC, extrusions, and sheet metal fabrication processes.
A proven and advanced understanding of Design for Manufacturability (DFM), Serviceability, Sustainability, and other DFx best practices.
Experience designing passive and active thermal solutions based on a variety of PC cooling technologies (including air and liquid cooled systems, heat pipes and vapor chambers, modern thermal interface materials, etc.)
Proficiency in standard thermomechanical tools, such as Flotherm
Demonstrated knowledge of acoustic noise management in PC systems
Experience working, and achieving results, through external ODM partners and/or suppliers
Ability to work confidently in a rapidly changing, fast-paced and results-oriented corporate environment where a high degree of flexibility is required
Excellent written and verbal communication skills in English

Required Qualifications:

Education & Work Experience

Bachelor's degree in mechanical engineering (or equivalent).
5+ years of thermal and/or mechanical engineering in the computer industry.
5+ years of experience working with PC ODMs and/or other technology suppliers to deliver commercially viable products.
Demonstrated understanding of advanced thermomechanical architecture as relates to PC or server system design.
Demonstrated working knowledge of industry-standard thermomechanical development tools.
Demonstrated experience with complex troubleshooting and system debug skills.

Preferred Qualifications:

Experience developing Mini PC (sub 3L) Systems for commercial and consumer applications
Familiarity with Intel Turbo Boost Technology and its implementation
Familiarity with Intel DPTF/DTT/IPF policies and their implementation
Understanding of thermal ergonomics and safety regulations
Knowledge of system-level design and manufacturing processes
Understanding of system and component reliability testing
Experience leading next generation product or technology planning.

Working Conditions:

Typically works in a lab environment doing hands-on work with prototype systems, etc.
Requires sitting, operating a computer keyboard, telephone and other office equipment for extended periods of time.
Weekly interaction with Asia-based colleagues and design partners in calls and meetings scheduled beyond typical core working hours (PST).
Occasional travel to visit ODMs or suppliers (in Asia) may be required (approx. 4%).

ASUS Computer International

New Jobs

Thermal/Mechanical System Architect