Sandia National Laboratories Microsystems and Engineering Sciences Applications (MESA) complex provides unique processing capability in semiconductor microfabrication. The MESAFab Operations departments develop and maintain core semiconductor processing capabilities and capacity that enable our customers to build differentiating Microsystems products. Two unique facilities are co-located within the 65,000 square foot MESAFab complex including: (1) a 12,000 square foot Class 1 Silicon Fab for 6-inch silicon wafer processing and (2) a 15,000 square foot Class 10 and Class 100 MicroFab for compound semiconductor material processing and silicon wafer post-processing. Key microfabrication processing areas include photolithography, reactive ion etch, wet etch/clean, oxidation and diffusion, thin films, CMP (planarization), ion implantation, metrology, deep reactive silicon ion etch, wafer bonding and thinning, electroplating, packaging, MEMS release, yield learning and statistical process control.
The Silicon Fab has processing expertise in CMOS and MEMS technologies. Over 150 equipment sets are maintained, supported and operated 20 hours per day, 5 days a week (2 shifts). Processing and maintenance expertise are staffed on all 2 shifts. We offer unique prototyping capabilities and are capable of producing full flow production lots as well as performing flexible process development.