DescriptionJob Description Overview:
The Thermal / Mechanical System Architect is responsible for architecting the system level thermal and mechanical design for our NUC products, which includes the system enclosure, thermal module, and physical interfacing. This is a key leadership role in defining and resolving system level challenges from early concepts and mock-ups through to final production. The ideal candidate will have experience in PC chassis and/or thermal module architecture and design and have a passion for inventing and working on new product innovations and rapid prototyping.
Essential Duties and Responsibilities:
- Leading the system-level and component-level thermal and mechanical conceptual design across various small form factor systems and throughout the product life cycle.
- Defining system architecture for new products, while balancing performance, system-level acoustics, cost, and schedule requirements.
- Creating ground-up 3D models and renderings based on the team's vision for the product, clearly supporting the expected system performance and aesthetics.
- Creatively solving challenging thermal scenarios in high-density (high wattage per unit volume) systems to drive new system-level innovations
- Designing and running thermal and heat-flow simulations, using standard industry-leading tools, to better inform early design ideas and partner feedback
- Creating, fabricating, and validating ground-up system mock-ups and prototypes as part of advanced system planning
- Reviewing and refining ODM/supplier thermomechanical design proposals to ensure that they deliver the best performing solutions to meet the project needs
- Validating physical designs and components, including hands-on testing of samples
- Implementing and validating platform thermal management systems
- Tuning the final thermal and power management subsystem for optimal system performance and acoustics, which may include fan table configuration, dynamic system sensing and response, etc.
- Drive the resolution of various thermomechanical-related issues throughout the product life cycle
- Working on-site in a lab environment and meeting regularly with partners in Asia time zones
Knowledge and Skills:
- Advanced proficiency in MCAD design tools (e.g., Creo, Solidworks).
- Knowledge of materials, structural, stress, acoustic, EMI/RFI, vibration, and industry standards is a plus.
- Working experience and proficiency in injection molding, CNC, extrusions, and sheet metal fabrication processes.
- A proven and advanced understanding of Design for Manufacturability (DFM), Serviceability, Sustainability, and other DFx best practices.
- Experience designing passive and active thermal solutions based on a variety of PC cooling technologies (including air and liquid cooled systems, heat pipes and vapor chambers, modern thermal interface materials, etc.)
- Proficiency in standard thermomechanical tools, such as Flotherm
- Demonstrated knowledge of acoustic noise management in PC systems
- Experience working, and achieving results, through external ODM partners and/or suppliers
- Ability to work confidently in a rapidly changing, fast-paced and results-oriented corporate environment where a high degree of flexibility is required
- Excellent written and verbal communication skills in English
Required Qualifications:
Education & Work Experience
- Bachelor's degree in mechanical engineering (or equivalent).
- 5+ years of thermal and/or mechanical engineering in the computer industry.
- 5+ years of experience working with PC ODMs and/or other technology suppliers to deliver commercially viable products.
- Demonstrated understanding of advanced thermomechanical architecture as relates to PC or server system design.
- Demonstrated working knowledge of industry-standard thermomechanical development tools.
- Demonstrated experience with complex troubleshooting and system debug skills.
Preferred Qualifications:
- Experience developing Mini PC (sub 3L) Systems for commercial and consumer applications
- Familiarity with Intel Turbo Boost Technology and its implementation
- Familiarity with Intel DPTF/DTT/IPF policies and their implementation
- Understanding of thermal ergonomics and safety regulations
- Knowledge of system-level design and manufacturing processes
- Understanding of system and component reliability testing
- Experience leading next generation product or technology planning.
Working Conditions:
- Typically works in a lab environment doing hands-on work with prototype systems, etc.
- Requires sitting, operating a computer keyboard, telephone and other office equipment for extended periods of time.
- Weekly interaction with Asia-based colleagues and design partners in calls and meetings scheduled beyond typical core working hours (PST).
- Occasional travel to visit ODMs or suppliers (in Asia) may be required (approx. 4%).
